NXP Semiconductors has announced the MC33777, the world’s first battery junction box IC that integrates critical pack-level functions into a single device. Unlike conventional pack-level monitoring solutions that require multiple discrete components, external actuators and processing support, NXP’s MC33777 consolidates essential BMS functions. The IC significantly reduces design complexity, qualification and software development effort, and cost for OEMs, while enhancing the overall performance of the system.
This state-of-the-art IC can help protect high-voltage batteries from overcurrent by constantly monitoring the battery current and slope every eight microseconds. It detects and reacts to a wide matrix of configurable events up to 10 times faster than conventional ICs, for example, without waiting for specific current thresholds to be exceeded. The MC33777‘s fuse-emulation technology also enables the removal of expensive and low-reliability melting fuses from the system, yielding significant cost savings for OEMs and Tier 1s, increasing reliability and enhancing safety for the vehicle occupants. Electric vehicles traditionally deploy melting fuses to disconnect power to the vehicle in the event of an overload, with reliability as a critical safety factor.
“Integrating everything that’s required to monitor a battery pack and react quickly to safety-critical events into a single device delivers significant benefits for both OEMs and the end consumer. NXP’s MC33777 marks a new generation of battery junction box ICs for electric vehicles, delivering faster, safer and more affordable management solutions for high-voltage battery packs.”, says Jesus Ruiz Sevillano, Director of Product Marketing BMS at NXP Semiconductors